According to sources, Apple has been ordering up ordered key components for a new iPhone. This new device, expected to launch in September 2011, is said to be like the iPhone 4 but with a better eight-megapixel camera along with a thinner and lighter design.
A source said that the new iPhone will have Qualcomm wireless chips, compared to the Infineon Technologies chip used in the current iPhone 4. While Infineon is used by most operators, Qualcomm chips are used in phones for carrier Verizon Wireless.
The device was apparently scheduled for release over the Summer, but the problem came from contract manufacturer Hon Hai Precision Co. who was unable to improve its production yield rate. Hon Hai Chairman Terry Guo confirmed recently that manufacturing issues have hurt profitability.
“The touch-screen devices are so thin. It’s really difficult to install so many components into the iPhones and iPads,” said Gou. “We hope to raise the yield rate and volume in the second half, which will help improve our gross margin.”
“Apple’s sales estimates of the new iPhone are quite aggressive. It told us to prepare to help the company meet its goal of 25 million units by the end of the year,” said a person at one of Apple’s suppliers. “The initial production volume will be a few million units.”
Next year might see a more major iPhone revamp, with the possibility of a cheaper phone with an edge-to-edge screen.
Source: WallStreetJournal.com
